TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems.

• Subject matter expert in signal integrity design, simulation and validation activities through product development cycles
• Establishing signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers
• Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.
• Driving product development for business success
• Engaging in innovative simulation and test tool improvement and process enhancement
• Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint.
• Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences.
• Being an expert in analyzing competitive products and driving internal & competing IP positions

• Bachelor’s degree in Electrical Engineering; Master's Degree preferred
• Minimum of 10 years of relevant work experience in electrical Design, RF design or PCB design
• A solid understanding of electromagnetic theory and electrical circuit behavior
• Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
• Expert with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent)
• Expert with high-speed test equipment (VNA, TDR, BERT)
• Expert with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration.
• Expert with printed circuit board layout and design (Altium preferred), fabrication and assembly, especially as associated with connector FP and card-edge interfaces
• Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification.
• Experience with physical layer communications systems and architectures.
• Fluent in English (both verbal and written)
• Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.
• Expert in analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.
• Learning Capability: Open minded, coachable, willing to learn new skills, and motivated to grow
• Pro-active in identifying complex situations, providing solutions, and driving improvements to evolving procedures
• Experience writing technical papers and presenting to BU-level organizations, external conferences, and critical customer contacts
• Proficient at owning project SI responsibilities and driving team actions across multi-discipline engineering & manufacturing teams

Nice to Have Skills/Experience:

• Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system
• Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems)
• Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English
• Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction.
• Six Sigma methodologies or other strong data analytics background.
• Printed circuit board design, fabrication and assembly (Altium, AutoCAD)
• Experience in project leadership, especially as it applies across design, development & manufacturing teams
• Test equipment (oscilloscope, vector network analyzer, BERT)
• Signal conditioning techniques (equalization, amplification)
• Direct customer design and support experience
• Application and test knowledge of high-speed devices and equalization techniques