Phone interview - went well offered me an in person panel interview. Reneged on the interview when they saw my undergrad GPA was below 2.5. I convinced them to reconsider and had a preliminary interview. That was followed by a full interview which included a presentation by me to them on why I was a good fit for the job. The panel portion went well, but then they paired off two team members to interview me in private. They were again concerned about my undergrad credentials. My 10 years of relevant experience and great Masters degree GPA weren't compelling.

Onsite was cut short after just half of the one-on-one interviews. Recruiter was rude with her correspondence over email. Made an emphasis on having hands on experience with hardware when job description had no mention of it. One saving grace was that interview panel of engineers was kind and respectful during my onsite prior to being cut short.