I applied online. The process took 1 day. I interviewed at Qualcomm (Hyderābād) in Jan 2023
Interview
This interview is for Storage windows driver. Recruiter contacted me through job posting social website. Scheduled two interviews back to back. One round was taken by the person who is leaving company(interview is for his position). He doesn't seem to be interested at all in the interview. Asked few basic questions. Second round was almost 90 minutes. He asked many questions related to storage. Protocol and internals of NAND device(i am from storage background). I almost answered all the questions to his satisfaction. 1st round interviewer was bad. He is not engaging and not friendly at all. 2nd round interviewer was friendly but i felt it is like knowledge(free) sharing session. I have to explain a lot since he is curious to know what happens in device side. After 2 rounds HR notified me that i didn't get through the interview.
project related technical discussion.technical discussion in system verilog uvm , protocol knowledge. given some coding questions. puzzle questions . verilog, system verilog, uvm , axi protocol based questions. project architecture nd interface signals
I applied through a recruiter. The process took 2 weeks. I interviewed at Qualcomm in May 2024
Interview
4 technical rounds 45 mins to 1 hour reach, 1 managerial round.
First two rounds were virtual. Next two rounds of technical interview in person.
Focused on DV concepts, Formal methodology, SV/UVM, functional coverage.
Got the offer within next few days.
I applied through a staffing agency. The process took 2 weeks. I interviewed at Qualcomm (Pune) in Jan 2024
Interview
The interview process involved two rounds: coding and domain-specific. With good preparation, it's manageable and straightforward to crack. The coding round tests your problem-solving skills, while the domain-specific round assesses your expertise in the field. Overall, a positive and rewarding experience that boosts confidence and provides valuable insights
