I applied through other source. The process took 3 weeks. I interviewed at Apple (Cupertino, CA) in Oct 2022
Interview
The interviewers were fine - they wanted someone that can immediately get on board with the day-to-day tasks, though I was expecting more research-oriented work. But the recruiting process was very unclear that I was told it was the last round of interview and then I was asked to be interviewed again by someone else.
Interview questions [1]
Question 1
Describe the heat transfer process of a thin plate made of aluminum-steel alloy.
Technical interview consisting a 5-6 structural mechanics and FEA questions. I had several questions about what it’s like to work there but they told me they would ask the questions first. They were extremely serious the whole interview.
Interview questions [1]
Question 1
Imagine an aluminum plate is pinned at the edges and a point load is applied in the middle. Where is the shear stress the highest