Job Description

About the Project:
Backed by a $5M Central Gap Fund grant, our research group at the National University of Singapore (NUS) is commercializing a breakthrough Ultralow-K (ULK) Monolayer Amorphous Carbon (MAC) dielectric technology. Having successfully validated the core materials physics at the lab scale, we are now solving critical reactor scaling challenges to transition our UV-CVD prototype into a scalable 200mm/300mm commercial alpha tool. This technology solves the critical interconnect RC-delay bottleneck in sub-3nm advanced CMOS nodes and has already secured strong evaluation traction from top-tier global semiconductor and equipment manufacturers.

The Opportunity:
Are you a highly skilled systems integrator or NPI engineer looking to step away from standard fab shift rotations and rigid OEM maintenance routines?

We are seeking a true "Tool Builder" to act as our Lead Equipment Engineer and drive the commercial scale-up of our proprietary hardware.
This role offers a highly competitive base salary and a standard 5-day work week. More importantly, this is a foundational role: successful execution over the 2-year grant period offers a direct pathway to transition into a planned deep-tech spin-off as a core engineering leader. You will bring industry-standard engineering discipline to our academic research team, gaining the rare opportunity to engineer a first-of-its-kind semiconductor manufacturing tool that will directly impact the global sub-3nm interconnect roadmap.

Qualifications

Qualifications / Discipline:
Master's degree in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related engineering discipline.

Experience:
5-8 years of hands-on experience in the semiconductor equipment industry, specifically in thin-film tool R&D (e.g., Applied Materials, Lam Research, ASM, TEL) or New Product Introduction (NPI). Demonstrated expertise in tool qualification methodologies, baseline system testing, and Design of Experiments (DOE) is essential. You bring the commercial scale-up mindset and rigorous engineering discipline that academia typically lacks.